Panelization is needed when the PCB’s dimensions are smaller than 70 x 70mm or when they are in any other shape than square.
Yes, but you need to make sure you will send us the components according to our needs. SMT components must be supplied on reels, cut tape (must be continuous) and stick/tube or tray. If more than one PCB kind need the same part, do not cut it into strips, but keep it in a continuous strip of tape or in the reel. Please keep in mind that if you have more than 1 kind of PCBs to populate with components we will either need the components of each kind of PCB in different box shipped to us, or the components can be in the same box but packed individually for each kind of PCB. If one component is used in 2 or more PCBs it must have a note on the label that it is used on 2 kinds of PCBs.
Resistors, Capacitors and Diodes (0603, 0805, 1206, 2225, SOT, SOD, MELF) require a minimum of 50 pieces and must exceed the required quantity by 30 pieces.
Resistors, Capacitors and Diodes (0402, miniature packages) require a minimum of 100 pieces and must exceed the required quantity by 50 pieces.
More expensive parts as IC, QFP, Connectors etc must exceed the required quantity by 1-5 pieces, this will be arranged according to each case.
If we will provide the component from our stock, there will be no excessive part so there will be no additional charge. If we do not have the specific component in our stock we will order a few more than we need which we can ship them back to you.
Yes, we can do that. Although we need to see some photos first and the GERBER files to make sure that our machines can support the specific PCBs.
We will need the Gerber files, BOM and Centroid data (it is not mandatory if you do not have it).
Please download this excel file example.
Unfortunately we do not assembly BGA yet, it is in our near future plans to start this service as well.
Yes, we can also offer leaded PCBA services if it is asked.
Our assembly time ranges from 1 working days to a few weeks. This differs due to complexity of the job and quantity of PCBs.
a. Consigned/kitted: You supply us all the parts that your PCBs need. Please check the reference of how the parts should be sent to us.
b. Turn-Key: We supply you all the parts needed for your PCBs. We will only source from reliable suppliers such as Mouser, Digi-key, Farnell, etc. We do not mark up on the parts cost.
c. Partial Turn-key/Combo: You supply us some of the parts and we supply the rest.
In case of Partial Turn-key/Combo and Turn-Key, after we track down all the parts we will ask for your approval. Please be advised that stock might change any time without any notice.
We offer both SMT and THT PCB Assembly service. We also offer double sided assembly. We can populate the following components: 0402, 0603, 0805, 1206, 2225 and ICs down to 0.4mm pitch.
We will need GERBER FILES and DRILL FILES.
If the size of each PCB is less than 15 x 15mm then you will have to panelize it, or ask from us to panelize it.
Yes. But we also offer leaded PCBs if it is asked.
You can make an order starting from 1 piece.
After your files (GERBER & DRILL) pass our design rule check, fabrication will start immediately.
If the fabrication has already started we cannot stop it. Unfortunately on this case we cannot refund you.
If you find any defects please let us know immediately. We will respond as soon as possible. We can repair or re-fabricate the PCBs or we will refund full amount to you without asking to return the defective PCBs.
Inner layers: copper thickness / min. conductor | ||
Copper thickness | Conductor trace width / space | annular ring min. |
12μm | 75μm / 10μm | 90μm |
18μm | 90μm | 90μm |
35μm | 100μm | 100μm |
70μm | 175μm | 175μm |
405μm | 250μm | 250μm |
140μm | 300μm | 300μm |
Outer layers: copper thickness /min. conductor | ||
copper final thickness | conductor trace width / space | annular ring min. |
30μm | 75μm / 100μm 90μm | 90μm 90μm |
35μm | 100μm | 100μm |
70μm | 175μm | 175μm |
105μm | 250μm | 250μm |
140μm | 300μm | 300μm |
210μm | 500μm | 500μm |
400μm | 900μm | 900μm |
Solder stop Green | ||
Standard | On request | |
Clearance | 50μm | 40μm/25μm (BGA) |
Bridge width | 100μm | 80μm |
Cover | 100μm | 80μm |
Solder stop black, blue, white, red, yellow | ||
Standard | On request | |
Clearance | 50μm | 40μm |
Bridge width | 125μm | 100μm |
Cover | 150μm | 125μm |
Marking print parameters | ||
font height | ideal font height | min. font width* |
1,2mm | 150μm | 100μm |
1,5mm | 180μm | 125μm |
1,8mm | 200μm | 150μm |
spacing to pad min. | 150μm | |
spacing to solder stop clearance | 100μm | |
Never place marking print on pads.Will be removed by PCBArt before production. | ||
*Can lead to surcharge (special production) |
Pattern tolerances | |
Tolerance | |
Drilling (PTH) to conductive pattern outer layers | ±0,10mm |
Drilling (PTH) to conductive pattern inner layers | ±0,15mm |
Drilling (PTH) to milling pattern / contour | ±0,10mm |
Drilling (NPTH) to milling pattern / contour | ±0,10mm |
Drilling (PTH) to marking print | ±0,15mm |
Conductive pattern to solder resist | ±0,10mm |
Conductive pattern to marking print | ±0,20mm |
Hole to hole, one pass* PTH-PTH or NPTH-NPTH | ±0,05mm |
Hole to hole, two passes PTH-NPTH | ±0,10mm |
* Also applies for PTH-NPTH if they are drilled in one run (e.g. location holes for SMD stencils) |
Flexible PCB thickness | |
Type | Tolerance |
Flexible part thickness | ±50μm |
Stiffener thickness | ±50μm |
Vias & Drills | |
Plated-through holes (PTH) and component holes | ±0,10mm |
Non-plated-through-holes (NPTH) | ±0,08mm |
Press-fi t technology (drilled) | ±0,05mm |
> on request | ±0,10mm |
Press-fi t technology (milled*) | ±0,075mm |
*From a final diameter of approx. 6.0mm (depending on the surface) the holes are milled, not drilled. |
Scoring | |
Tolerance | |
Ofsset (to PCB center) | ±0,10mm |
Drilling (PTH) to scoring pattern | ±0,15mm |
Drilling (NPTH) to scoring pattern | ±0,20mm |
PCB dimension x/y | ±0,15mm |
Scoring depth | ±0,20mm |
Bow & Twist | |
Tolerance | |
For PCBs ≥ 0,8mm thickness | 0,75% with SMD |
1,50% without SMD | |
Please note that the twist & bow value is increased above average, if the copper balance of the PCB is locally very unequal or if the circuit board is very thin. |
Cu min. thckness throughplating | ||
class 2 (standard) | Class 3 | |
Via (> 150μm) | 20μm-25μm | 20μm-25μm |
Microvia (≤ 150μm) | 18μm-20μm | 20μm-25μm |
Blind Via | 10μm-12μm | 10μm-12μm |
Buried Via | 10μm-12μm | 10μm-12μm |